US 7,547,373 B2
Two-part epoxy adhesives with improved flexibility and process for making and using same
Zakar Raffi Hachikian, Belmont, Mass. (US)
Assigned to Illinois Tool Works, Inc., Glenview, Ill. (US)
Filed on Sep. 11, 2003, as Appl. No. 10/659,805.
Application 10/659805 is a continuation in part of application No. 10/269800, filed on Oct. 14, 2002, abandoned.
Prior Publication US 2004/0069405 A1, Apr. 15, 2004
Int. Cl. C09J 163/00 (2006.01); C08L 63/00 (2006.01); B32B 27/38 (2006.01)
U.S. Cl. 156—330  [523/400; 525/523; 525/524; 428/413] 49 Claims
 
40. A process of adhering at least two substrate surfaces to each other comprising:
intercalating between said surfaces an adhesive comprising a reactive mixture of:
a) a resin component comprising a mixture of epoxy resin, and internally flexible epoxy resin, and
b) a hardener component consisting essentially of a mixture by weight of:
30-80% flexibilizer, wherein said flexibilizer is selected from amine terminated butadiene acrylonitrile adducts or carboxyl terminated butadiene acrylonitrile adducts,
5-45% unmodified aliphatic amine, wherein said unmodified aliphatic amine comprises an unmodified glycol ether base aliphatic amine,
0-15% modified aliphatic amine, wherein said modified aliphatic amine comprises an AEP base modified amine,
0-15% unmodified or modified polyamide,
1-10% accelerator, wherein said accelerator is a tertiary amine accelerator, and
optionally 5-20% plasticizer/accelerator that acts as both a plasticizer and an accelerator; and
allowing said adhesive to cure,
wherein said reactive mixture has an initial cure time of less than 3 hours and a complete cure time of approximately 24 hours; whereby said cured adhesive has a tensile elongation at room temperature of greater than 30%, and
wherein said resin component is free of nonylphenol and said hardener component is free of nonylphenol.