US 7,547,335 B2
Metal polishing composition and method of polishing using the same
Hiroyuki Seki, Shizuoka (Japan); Katsuhiro Yamashita, Shizuoka (Japan); Tomohiko Akatsuka, Shizuoka (Japan); and Tadashi Inaba, Kanagawa (Japan)
Assigned to FUJIFILM Corporation, Tokyo (Japan)
Filed on Nov. 28, 2005, as Appl. No. 11/287,386.
Claims priority of application No. P.2004-342394 (JP), filed on Nov. 26, 2004; and application No. P.2005-071153 (JP), filed on Mar. 14, 2005.
Prior Publication US 2006/0115973 A1, Jun. 01, 2006
Int. Cl. B24D 3/02 (2006.01); C09C 1/68 (2006.01)
U.S. Cl. 51—307  [438/600; 106/3] 6 Claims
 
1. A metal polishing composition comprising a compound represented by formula (1):

OG Complex Work Unit Drawing
wherein R1 represents a single bond, an alkylene group or a phenylene group; R2 and R3 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group or an aryl group; and R4 and R5 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group or an acyl group provided that when R1 represents a single bond, R4 and R5 do not simultaneously represent a hydrogen atom;
and a compound represented by formula (2):

OG Complex Work Unit Drawing
wherein R6 represents a single bond, an alkylene group or a phenylene group; R7 and R8 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group or an aryl group; R9 represents a hydrogen atom, a halogen atom, a carboxyl group or an alkyl group; R10 represents an alkylene group; with proviso that, when R10 represents a methylene group, formula (2) satisfies at least one of a condition that R6 is not a single bond and a condition that R9 is not a hydrogen atom,
and an oxidizing agent.