| US 7,546,002 B2 | ||
| Printed circuit board and manufacturing method thereof | ||
| Han Seo Cho, Daejeon (Korea, Republic of); Je-Gwang Yoo, Yongin-si (Korea, Republic of); Sang-Hoon Kim, Gunpo-si (Korea, Republic of); and Joon-Sung Kim, Suwon-si (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon (Korea, Republic of) | ||
| Filed on Aug. 14, 2007, as Appl. No. 11/889,477. | ||
| Claims priority of application No. 10-2006-0079003 (KR), filed on Aug. 21, 2006. | ||
| Prior Publication US 2008/0044129 A1, Feb. 21, 2008 | ||
| Int. Cl. G02B 6/12 (2006.01); G02B 6/10 (2006.01) | ||
| U.S. Cl. 385—14 [385/129; 385/130; 385/132] | 3 Claims |
| 1. A printed circuit board having an optical waveguide formed therein for transmitting optical signals together with electrical
signals, the printed circuit board comprising:
a cladding;
a core embedded in the cladding and configured to transmit optical signals;
a wiring pattern embedded in the cladding such that at least a portion of one side of the wiring pattern is exposed to the
exterior of the cladding, and configured to transmit electrical signals; and
an optoelectric device mounted on the cladding and connected to the wiring pattern.
|