| US 7,545,021 B1 | ||
| Apparatus and method for making integrated circuit packages having integrated circuits mounted onto passive electrical components | ||
| Eric Anthony Sagen, Longmont, Colo. (US); and James T. Doyle, Nederland, Colo. (US) | ||
| Assigned to National Semiconductor Corporation, Santa Clara, Calif. (US) | ||
| Filed on Jul. 14, 2005, as Appl. No. 11/182,227. | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—531 [257/678; 257/E21.022] | 21 Claims |
| 1. An apparatus, comprising:
an inductor having a magnetic core and a wire wrapped around the magnetic core, the core having a recess therein;
an integrated circuit die positioned in and supported by the recess in the magnetic core of the inductor such that the integrated
circuit is supported by the magnetic core;
a plurality of electrical traces formed on the magnetic core, wherein at least one of the electrical traces is configured
to electrically couple the wire of the inductor with the integrated circuit die positioned on the inductor; and
a plurality of exposed contacts formed on the magnetic core that are suitable for electrical connection to an external device,
wherein the contacts and the recess are formed on a first surface of the magnetic core and wherein a selected plurality of
the electrical traces are configured to help electrically couple the integrated circuit die to associated ones of the exposed
contacts without involving the wire wrapped around the magnetic core.
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