US 7,544,898 B2
Multilayer wiring board, touch panel and manufacturing method of the same
Tomio Hirano, Miyagi (Japan); Masao Ono, Miyagi (Japan); and Nobuyuki Oikawa, Miyagi (Japan)
Assigned to Sony Corporation, Tokyo (Japan)
Filed on Oct. 06, 2003, as Appl. No. 10/678,062.
Claims priority of application No. 2002-306146 (JP), filed on Oct. 21, 2002.
Prior Publication US 2004/0074671 A1, Apr. 22, 2004
Int. Cl. H05K 1/16 (2006.01)
U.S. Cl. 174—259  [361/803; 361/804] 6 Claims
OG exemplary drawing
 
1. A multilayer wired board including at least part of an electrical circuit board in which a plurality of wired boards are stacked so as to face their wired surfaces toward each other, comprising:
electrical connection parts between said wired boards are connected through a first end of an elastic conductive material part adhered to a first wired board, and a second end of the elastic conductive material part in contact with a second wired board;
a double-sided adhesive material part is provided between the plurality of wired boards to adhere them together, and an opening is formed in the double-sided adhesive material part so as to surround at least part of a peripheral edge portion of said elastic conductive material part to seal said plurality of wired boards;
wherein a height of said double-sided adhesive material part is smaller than a height of said elastic conductive material part,
the second end of the elastic conductive material part and a peripheral part of the second wired board are bent and pressed together, and
said elastic conductive material part does not contact said double-sided adhesive material part.