| US 7,544,587 B2 | ||
| Wafer dividing method and wafer dividing apparatus | ||
| Yosuke Watanabe, Tokyo (Japan); Keiji Nomaru, Tokyo (Japan); Nobumori Ogoshi, Tokyo (Japan); Koichi Mitani, Tokyo (Japan); Taizo Kise, Tokyo (Japan); Kohei Matsumoto, Tokyo (Japan); Tatsuya Inaoka, Tokyo (Japan); and Masaru Nakamura, Tokyo (Japan) | ||
| Assigned to Disco Corporation, Tokyo (Japan) | ||
| Filed on Jan. 08, 2007, as Appl. No. 11/650,503. | ||
| Claims priority of application No. 2006-005893 (JP), filed on Jan. 13, 2006. | ||
| Prior Publication US 2007/0164073 A1, Jul. 19, 2007 | ||
| Int. Cl. H01L 21/301 (2006.01) | ||
| U.S. Cl. 438—460 [438/458; 257/E21.599; 451/9] | 5 Claims |
| 1. A wafer dividing apparatus for dividing a wafer having a substrate with a protective film on a surface of the substrate,
which substrate is put on an adhesive tape that is mounted on an annular frame so as to cover an inner opening of the annular
frame, the annular frame dividing the wafer along predetermined dividing lines, the apparatus comprising:
a frame holding means having a holding surface for holding the annular frame;
a wafer pressing member having a pressing surface to be applied to a wafer mounting area of the adhesive tape mounted on the
annular frame supported by a wafer holding means;
a cooling chamber, formed above the holding surface of the frame holding means, and including a cover to open and close for
heat insulating the frame holding means, the cooling chamber being between the cover and the holding surface of the frame
holding means;
a cooling means being a cooling gas feed means which feeds a cooling gas into the cooling chamber; and
a moving means for moving the wafer pressing member from a relief position below the holding surface of the frame holding
means to a pressing position above the holding surface of the frame holding means to expand the adhesive tape and to divide
the protective film with tensile force at the time of cooling.
|