| US 7,543,621 B2 | ||
| Method and apparatus for bonding polarizing plate | ||
| Takayuki Kanbara, Kanagawa (Japan); Naoki Sakai, Kanagawa (Japan); and Ryoichi Sugihara, Kanagawa (Japan) | ||
| Assigned to FUJIFILM Corporation, Tokyo (Japan) | ||
| Filed on Jan. 30, 2006, as Appl. No. 11/341,534. | ||
| Application 11/341534 is a division of application No. 10/608778, filed on Jun. 30, 2003, granted, now 7,022,204. | ||
| Claims priority of application No. 2002-189044 (JP), filed on Jun. 28, 2002; application No. 2002-195467 (JP), filed on Jul. 04, 2002; application No. 2002-195468 (JP), filed on Jul. 04, 2002; and application No. 2003-139325 (JP), filed on May 16, 2003. | ||
| Prior Publication US 2006/0124248 A1, Jun. 15, 2006 | ||
| Int. Cl. B29C 65/48 (2006.01); B32B 37/00 (2006.01); B32B 38/04 (2006.01); B32B 38/10 (2006.01) | ||
| U.S. Cl. 156—516 [156/542] | 24 Claims |
| 1. A polarizing plate bonding apparatus comprising
cutting means for cutting at least a polarizing plate and an adhesive layer of a strip-shaped film, composed of said polarizing
plate and a release film bonded to said polarizing plate with interposition of said adhesive layer, so as to leave the release
film uncut, when a forward end side pre-severed end face of said strip-shaped film perpendicular to a longitudinal direction
of said strip-shaped film has traveled a length corresponding to a length of a substrate, to form a film piece release film
separating means for separating said release film from the film piece severed by said cutting,
bonding means for bonding a tacky surface of said film piece, freed of said release film, to a mating position of said substrate
so that a forward end side end face of the transported substrate is parallel to the severed end face of said film piece; and
wherein said release film separating means comprises a separating roll arranged on said film piece supplying means on the
surface of said film piece facing the release film surface for thrusting towards said film piece supplying means.
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