| US 7,543,547 B1 | ||
| Electrode assembly for plasma processing apparatus | ||
| William S. Kennedy, Fremont, Calif. (US); and David E. Jacob, Fremont, Calif. (US) | ||
| Assigned to Lam Research Corporation, Fremont, Calif. (US) | ||
| Filed on Jul. 22, 2003, as Appl. No. 10/623,540. | ||
| Claims priority of provisional application 60/400451, filed on Jul. 31, 2002. | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. C23C 16/50 (2006.01); C23C 16/509 (2006.01); C23F 1/00 (2006.01); H01L 21/306 (2006.01); C23C 16/505 (2006.01) | ||
| U.S. Cl. 118—723E [118/723 R; 156/345.33; 156/345.34] | 29 Claims |
| 1. A component of a plasma processing apparatus, comprising:
a graphite backing plate bonded to a silicon showerhead electrode, the backing plate including a plurality of through apertures
having a first portion and a second portion wider than the first portion; and
a plurality of first fastener members each mounted in an aperture of the backing plate, each first fastener member including
a non-circular shaped head configured to prevent rotation of the first fastener members relative to the backing plate, the
head having a bearing surface bonded to a surface that at least partially defines the second portion of the aperture.
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