US 7,543,381 B2
Method of manufacturing a liquid ejecting head
Hideyuki Ogawa, Nagano (Japan); Koichi Saito, Nagano (Japan); Nagamitsu Takashima, Nagano (Japan); Nobuyuki Soma, Nagano (Japan); and Katsunori Ono, Nagano (Japan)
Assigned to Seiko Epson Corporation, Tokyo (Japan)
Filed on Apr. 28, 2006, as Appl. No. 11/413,591.
Application 11/413591 is a division of application No. 11/213837, filed on Aug. 30, 2005.
Claims priority of application No. P2004-249598 (JP), filed on Aug. 30, 2004; and application No. P2004-253846 (JP), filed on Sep. 01, 2004.
Prior Publication US 2006/0191389 A1, Aug. 31, 2006
Int. Cl. B23P 17/00 (2006.01)
U.S. Cl. 29—890.1  [29/890.09; 347/44; 347/45] 3 Claims
OG exemplary drawing
 
1. A method of manufacturing a liquid ejection head, comprising:
providing a first metal plate;
supporting the first metal plate on a female die;
forming a plurality of recesses in the first metal plate so as to be arrayed in a first direction;
opposing a male die to the recess, the male die comprising a punch array in which a plurality of punches arrayed in the first direction;
actuating the male die in a second direction perpendicular to the first direction to form a through hole at a bottom portion of each of the recesses with each of the punches;
providing a second metal plate formed with a plurality of nozzle orifices; and
joining the first metal plate and the second metal plate such that each of the nozzle orifices is communicated with one of the recesses, wherein:
a contour line of the punch array defined by connecting respective distal end faces of the punches includes a plurality of parts assuming straight lines extending in the first direction; and
one of straight lines which is closer to an end of the punch array is farther from the female die than one of the straight lines which is closer to a center of the punch array, in accordance with a warp of the plate member due to the formation of the recesses.