| US 7,542,305 B2 | ||
| Memory module having on-package or on-module termination | ||
| Ryan M. Petersen, San Jose, Calif. (US); and Franz Michael Schuette, Colorado Springs, Colo. (US) | ||
| Assigned to OCZ Technology Group, Inc., San Jose, Calif. (US) | ||
| Filed on Aug. 25, 2005, as Appl. No. 11/162,029. | ||
| Claims priority of provisional application 60/522171, filed on Aug. 25, 2004. | ||
| Prior Publication US 2006/0056215 A1, Mar. 16, 2006 | ||
| Int. Cl. H01R 12/16 (2006.01) | ||
| U.S. Cl. 361—785 [361/764; 361/803; 365/63] | 10 Claims |
| 1. A memory module installed in a memory socket on a mainboard of a computer, the memory module comprising:
a substrate;
an edge connector comprising pins along an edge of the substrate;
multiple memory packages mounted to the substrate, each of the memory packages containing a memory die electrically connected
to input/output leads located on the memory package and through which data signals are transmitted to and from the memory
die;
data signal lines electrically connecting a plurality of the input/output leads of the memory package to a plurality of the
pins of the edge connector; and
termination resistors mounted on each of the memory packages and individually terminating each of the input/output leads of
each memory package to a supply voltage or a reference voltage of the memory package;
wherein the memory die and the mainboard lack termination resistors, and the termination resistors operate to reduce noise
and signal reflections through the data signal lines.
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