US 7,542,128 B2
Exposure apparatus, exposure method, and method for producing device
Hiroyuki Nagasaka, Kumagaya (Japan); Soichi Owa, Kumagaya (Japan); and Yasugumi Nishii, Kumagaya (Japan)
Assigned to Nikon Corporation, Tokyo (Japan)
Filed on Jul. 18, 2007, as Appl. No. 11/879,514.
Application 11/879514 is a division of application No. 11/211749, filed on Aug. 26, 2005, granted, now 7,268,854.
Application 11/211749 is a continuation of application No. PCT/JP2004/002295, filed on Feb. 26, 2004.
Claims priority of application No. 2003-049365 (JP), filed on Feb. 26, 2003; application No. 2003-110748 (JP), filed on Apr. 15, 2003; and application No. 2003-320100 (JP), filed on Sep. 11, 2003.
Prior Publication US 2007/0263186 A1, Nov. 15, 2007
Int. Cl. G03B 27/42 (2006.01); G03B 27/52 (2006.01)
U.S. Cl. 355—53  [355/30] 23 Claims
OG exemplary drawing
 
1. An exposure apparatus which exposes a substrate by projecting an image of a predetermined pattern through a liquid onto the substrate, the exposure apparatus comprising:
a projection optical system which projects the image of the pattern onto the substrate;
a liquid supply mechanism which has a supply flow passage through which the liquid is supplied onto the substrate; and
a liquid recovery mechanism which has a recovery flow passage through which the supplied liquid is recovered, wherein:
at least one of the supply flow passage and the recovery flow passage is formed in a stacked member in which a plurality of plate members are stacked.