| US 7,541,898 B2 | ||
| High isolation tunable MEMS capacitive switch | ||
| Jiangyuan Qian, Irvine, Calif. (US); Hung-Pin Chang, Irvine, Calif. (US); Bedri A. Cetiner, Irvine, Calif. (US); Mark Bachman, Irvine, Calif. (US); Franco DeFlaviis, Irvine, Calif. (US); and Guann-Pyng Li, Irvine, Calif. (US) | ||
| Assigned to Regents of the University of California, Oakland, Calif. (US) | ||
| Filed on Sep. 04, 2007, as Appl. No. 11/849,914. | ||
| Application 11/849914 is a continuation of application No. 11/080112, filed on Mar. 14, 2005, granted, now 7,265,647. | ||
| Claims priority of provisional application 60/552906, filed on Mar. 12, 2004. | ||
| Prior Publication US 2008/0129426 A1, Jun. 05, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01P 1/10 (2006.01); B81B 5/00 (2006.01) | ||
| U.S. Cl. 333—262 [333/105] | 17 Claims |
| 1. A radio frequency (RF) micro-electromechanical system (MEMS) switch system, comprising:
a first electrode and a second electrode, the second electrode having a first insulator located thereon;
a conductive line located between the first and second electrodes and having a second insulator located thereon; and
a deflectable member coupled with the first electrode and the first insulator located on the second electrode, the deflectable
member being in spaced relation with the conductive line, wherein the deflectable member is deflectable between an up-state
out of contact with the second insulator and a down-state coupled with the second insulator,
wherein the first electrode, second electrode and conductive line are located on a printed circuit board (PCB) substrate.
|