| US 7,541,683 B2 | ||
| Semiconductor integrated circuit device | ||
| Hideo Sonohara, Kanagawa (Japan); and Taro Sakurabayashi, Kanagawa (Japan) | ||
| Assigned to NEC Electronics Corporation, Kanagawa (Japan) | ||
| Filed on Mar. 22, 2007, as Appl. No. 11/723,827. | ||
| Claims priority of application No. 2006-081347 (JP), filed on Mar. 23, 2006. | ||
| Prior Publication US 2007/0222082 A1, Sep. 27, 2007 | ||
| Int. Cl. H01L 29/40 (2006.01) | ||
| U.S. Cl. 257—786 [257/692] | 18 Claims |
| 1. A semiconductor integrated circuit device comprising:
a plurality of power pads placed on a semiconductor chip; and
a plurality of signal pads placed on the semiconductor chip and configured to have a width less than that of said power pads,
wherein the plurality of signal pads include a first signal pad positioned in a first direction and a second signal pad positioned
in a second direction different from the first direction.
|