| US 7,541,678 B2 | ||
| Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board | ||
| Yoshihiro Nishida, Akishima (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jun. 06, 2005, as Appl. No. 11/144,717. | ||
| Claims priority of application No. 2004-287091 (JP), filed on Sep. 30, 2004. | ||
| Prior Publication US 2006/0076683 A1, Apr. 13, 2006 | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) | ||
| U.S. Cl. 257—758 [257/786; 257/776; 257/773; 361/777; 361/778] | 7 Claims |
| 1. A printed wiring board, comprising:
an insulating layer having a shape of a rectangle and provided with a fiber therein, a direction of the fiber being almost
parallel to a side of the rectangle;
a reference potential layer disposed on a first surface of the insulating layer;
a plurality of wiring patterns for signal transmission disposed on a second surface of the insulating layer, an entire of
each of the plural wiring patterns being in contact with the second surface of the insulating layer, and directions of the
plural wiring patterns having in a plan view nearly similar obliquely-crossing angles with respect to the direction of the
fiber in the insulating layer; and
a pad portion to mount a semiconductor device, disposed on the second surface of the insulating layer to conduct the plural
wiring patterns.
|