| US 7,541,669 B2 | ||
| Semiconductor device package with base features to reduce leakage | ||
| Patrick Joseph Carberry, Laurys Station, Pa. (US); Jeffery John Gilbert, Schwenksville, Pa. (US); George John Libricz, Jr., Bethlehem, Pa. (US); Ralph Salvatore Moyer, Robesonia, Pa. (US); John William Osenbach, Kutztown, Pa. (US); Hugo Fernando Safar, Westfield, N.J. (US); and Thomas Herbert Shilling, Macungie, Pa. (US) | ||
| Assigned to Agere Systems Inc., Allentown, Pa. (US) | ||
| Filed on Apr. 19, 2007, as Appl. No. 11/788,346. | ||
| Application 11/788346 is a division of application No. 11/015534, filed on Dec. 18, 2004, granted, now 7,224,047, filed on May 29, 2007. | ||
| Prior Publication US 2007/0241433 A1, Oct. 18, 2007 | ||
| Int. Cl. H01L 33/00 (2006.01); H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—676 [257/E33.075; 257/675; 257/E33.057; 257/99; 257/433; 257/696; 257/712; 257/704; 257/707; 257/706; 257/710; 257/713; 257/680; 257/795; 257/784; 257/786] | 16 Claims |
| 1. A semiconductor device package comprising:
a container including a base and sidewalls, said base configured to support a semiconductor device chip, said base and sidewalls
comprising materials having different thermal expansion coefficients, and
a lead frame extending through at least one of said sidewalls, characterized in that said base has at least one reentrant
feature that is positioned within the thickness of at least one of said sidewalls and engages said at least one sidewall,
wherein the at least one reentrant feature is a hook-like flange that engages a reciprocal feature of the at least one sidewall
to inhibit lateral separation of the at least one sidewall from the base.
|