| US 7,541,620 B2 | ||
| Semiconductor device, light emitting diode print head, and image forming apparatus | ||
| Tomohiko Sagimori, Tokyo (Japan); Mitsuhiko Ogihara, Tokyo (Japan); Hiroyuki Fujiwara, Tokyo (Japan); and Masataka Muto, Tokyo (Japan) | ||
| Assigned to Oki Data Corporation, Tokyo (Japan) | ||
| Filed on Aug. 30, 2007, as Appl. No. 11/896,189. | ||
| Claims priority of application No. 2006-235559 (JP), filed on Aug. 31, 2006. | ||
| Prior Publication US 2008/0054273 A1, Mar. 06, 2008 | ||
| Int. Cl. H01L 29/205 (2006.01) | ||
| U.S. Cl. 257—91 [257/79] | 18 Claims |
| 1. A semiconductor device comprising:
a plurality of light emitting elements formed of a thin layer of a compound semiconductor and arranged in a row in one direction
with an equal interval therebetween,
wherein each of said light emitting elements includes:
a light emitting area formed on a first surface of the light emitting element;
a first conductive type side electrode formed on the first surface and electrically connected to one side of the light emitting
element, said first conductive type side electrode being disposed at a position continuously surrounding at lease two sides
of the light emitting area in a first direction that the light emitting elements are arranged and a second direction perpendicular
to the first direction; and
a second conductive type side electrode formed on the first surface and electrically connected to the other side of the light
emitting element, said second conductive type side electrode being disposed on the light emitting area.
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