| US 7,541,404 B2 | ||
| Water-borne resin composition and electrocoating composition | ||
| Noriyuki Nakazawa, Ibaraki (Japan); Takayuki Kokubun, Suita (Japan); Ichiro Kawakami, Takatsuki (Japan); and Hiroyuki Sakamoto, Kobe (Japan) | ||
| Assigned to Nippon Paint Co., Ltd., Osaka (Japan) | ||
| Filed on May 09, 2007, as Appl. No. 11/797,947. | ||
| Application 11/797947 is a continuation of application No. 10/933489, filed on Sep. 03, 2004, granted, now 7,259,206. | ||
| Claims priority of application No. 2003-312568 (JP), filed on Sep. 04, 2003. | ||
| Prior Publication US 2007/0219308 A1, Sep. 20, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. C08L 79/08 (2006.01); C08L 77/00 (2006.01) | ||
| U.S. Cl. 524—538 [528/335; 528/342; 528/345; 528/350] | 4 Claims |
| 1. A water-borne resin composition, having a hydrolysable functional group and a polymerizable unsaturated carbon bond,
wherein said water-borne resin composition contains at least one species selected from the group consisting of a polyamide-imide
resin, a polyamide resin and a polyimide resin as a base resin, and
wherein said polymerizable unsaturated carbon bond is contained in the base resin.
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