| US 7,541,224 B2 | ||
| Active matrix type display device and method of manufacturing the same | ||
| Tsuyoshi Hioki, Kanagawa-Ken (Japan); Masahiko Akiyama, Tokyo (Japan); Mitsuo Nakajima, Kanagawa-Ken (Japan); Yujiro Hara, Kanagawa-Ken (Japan); and Yutaka Onozuka, Kanagawa-Ken (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Nov. 22, 2005, as Appl. No. 11/283,859. | ||
| Application 11/283859 is a division of application No. 10/438940, filed on May 16, 2003, granted, now 6,987,284. | ||
| Claims priority of application No. 2002-142373 (JP), filed on May 17, 2002. | ||
| Prior Publication US 2006/0076561 A1, Apr. 13, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—149 [438/459; 257/59] | 1 Claim |
| 1. A method of manufacturing an active matrix type display device, the method comprising:
forming active elements each corresponding to a pixel on a device forming substrate of glass;
polishing the device forming substrate to make it thinner by first performing a mechanical polishing, and then performing
a chemical polishing, a thickness of the device forming substrate being 5 μm or more but 100 μm or less after polishing the
device forming substrate, and a height of projections and depressions of the device forming substrate being in a range of
a fiftieth to a half of the thickness;
bonding a surface of the device forming substrate, which has been polished, to a plastic substrate via an adhesion layer;
and
forming a display driven by the active elements to display an image pixel by pixel, by placing a counter substrate so as to
oppose to the device forming substrate.
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