| US 7,541,220 B2 | ||
| Integrated circuit device having flexible leadframe | ||
| Timothy Brooks Bambridge, Pittstown, N.J. (US); Jeffery J. Gilbert, Schwenksville, Pa. (US); Juan Alejandro Herbsommer, Schnecksville, Pa. (US); Jeffrey Michael Klemovage, Whitehall, Pa. (US); and George John Libricz, Jr., Bethlehem, Pa. (US) | ||
| Assigned to Agere Systems Inc., Allentown, Pa. (US) | ||
| Filed on Dec. 14, 2005, as Appl. No. 11/302,690. | ||
| Prior Publication US 2006/0097367 A1, May 11, 2006 | ||
| Int. Cl. H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—123 [438/122; 438/125; 257/666; 257/668; 257/671; 257/706] | 20 Claims |
| 1. A method of producing a flexible leadframe, the flexible leadframe comprising a plurality of stacked flexible layers including
at least one flexible insulating layer, the method comprising the steps of:
defining a plurality of electrically conductive traces on the at least one flexible insulating layer;
embedding at least one circuit component; and
configuring the flexible layers for use as a flexible leadframe in an integrated circuit device;
wherein a first one of the flexible layers overlays a first portion of a second one of the flexible layers;
wherein a second portion of the second flexible layer remains exposed through an opening in the first flexible layer; and
wherein the second portion of the second flexible layer is configured for receiving at least one electrical connection to
an integrated circuit die.
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