| US 7,541,212 B2 | ||
| Image sensor including an anti-reflection pattern and method of manufacturing the same | ||
| Tae-Seok Oh, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Suwon-si (Korea, Republic of) | ||
| Filed on Mar. 16, 2006, as Appl. No. 11/377,485. | ||
| Claims priority of application No. 10-2005-0026274 (KR), filed on Mar. 30, 2005. | ||
| Prior Publication US 2006/0220025 A1, Oct. 05, 2006 | ||
| Int. Cl. H01L 23/58 (2006.01); H01L 29/04 (2006.01) | ||
| U.S. Cl. 438—48 [438/70] | 9 Claims |

| 1. A method of manufacturing an image sensor, comprising:
providing a substrate including a first area and a second area, wherein a photodiode is formed in the first area of the substrate
and the second area surrounds the first area;
forming an insulation pattern structure making contact with the photodiode in the first area of the substrate;
forming an anti-reflection layer on the insulation pattern structure and on the substrate;
forming a preliminary insulation interlayer structure having a plurality of insulation layers on the anti-reflection layer
and on the substrate, the preliminary insulation interlayer structure including a first metal wiring structure in the first
area and a second metal wiring structure in the second area, wherein a top surface of the second metal wiring structure in
the second area is above that of the first metal wiring structure in the first area;
forming a recess portion in the first area of the substrate by partially etching the preliminary insulation interlayer structure,
to form a first preliminary insulation interlayer structure on the first area of the substrate and form a second preliminary
insulation interlayer structure on the second area of the substrate;
partially etching the first preliminary insulation interlayer structure and the anti-reflection layer corresponding to the
photodiode, to form a first insulation interlayer structure having a second opening and form an anti-reflection pattern having
a first opening connected to the second opening;
forming a transparent insulation pattern in the first and second openings;
forming a color filter on the transparent insulation pattern; and
forming a micro lens on the color filter.
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