| US 7,541,211 B2 | ||
| Photoelectric conversion device, its manufacturing method, and image pickup device | ||
| Seiichi Tamura, Yokohama (Japan); Hiroshi Yuzurihara, Atsugi (Japan); Shigeru Nishimura, Ebina (Japan); Ryuichi Mishima, Machida (Japan); and Yasushi Nakata, Yokohama (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Dec. 28, 2005, as Appl. No. 11/318,930. | ||
| Claims priority of application No. 2004-379954 (JP), filed on Dec. 28, 2004. | ||
| Prior Publication US 2006/0141655 A1, Jun. 29, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—48 | 5 Claims |

| 1. A manufacturing method of a photoelectric conversion device including a silicon substrate, a plurality of photoelectric
conversion elements each including a charge storage region on a principal plane of the silicon substrate, and a plurality
of transfer MOS transistors for transferring charge from the charge storage regions, wherein the principal plane has an off-angle
orientation forming an angle θ with at least two planes arranged in opposition to each other and perpendicular to a reference
(1 0 0) plane within a range of 3.5°≤θ≤4.5°, and wherein the at least two planes form a two-plane direction, the method comprising:
forming the charge storage regions by injecting ions at an ion injecting direction into the plurality of photoelectric conversion
elements, the ion injecting direction being a same direction for respective ones of the plurality of photoelectric conversion
elements, such that the ion injecting direction forms an angle φ relative to a direction perpendicular to the principal plane
within a range of 0°<φ≤45°, and such that a direction of a projection of the ion injecting direction to the principal plane
forms an angle α with the two plane direction within a range of 0°<α<90°,
wherein for each charge storage region:
a part of the charge storage region is arranged under a part of a gate electrode of a corresponding transfer MOS transistor,
and
a direction of the part of the charge storage region arranged under the gate electrode as seen from a corresponding photoelectric
conversion element forms the angle α with the two plane direction within a range of 40°≤α≤50°.
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