US 7,541,138 B2
Resist composition
Taku Hirayama, Kawasaki (Japan); Hideo Hada, Kawasaki (Japan); Satoshi Fujimura, Kawasaki (Japan); Takeshi Iwai, Kawasaki (Japan); Mitsuru Sato, Kawasaki (Japan); Ryoichi Takasu, Kawasaki (Japan); Toshikazu Tachikawa, Kawasaki (Japan); Jun Iwashita, Kawasaki (Japan); Keita Ishiduka, Kawasaki (Japan); Tomotaka Yamada, Kawasaki (Japan); Toshikazu Takayama, Kawasaki (Japan); and Masaaki Yoshida, Kawasaki (Japan)
Assigned to Tokyo Ohka Kogyo Co., Ltd., Kawasaki (Japan)
Filed on Jan. 10, 2007, as Appl. No. 11/621,895.
Application 11/621895 is a continuation of application No. 10/845620, filed on May 13, 2004.
Application 10/845620 is a continuation in part of application No. PCT/JP2004/00704, filed on Jan. 27, 2004.
Claims priority of application No. 2003-025152 (JP), filed on Jan. 31, 2003; application No. 2003-045000 (JP), filed on Feb. 21, 2003; application No. 2003-062531 (JP), filed on Mar. 07, 2003; application No. 2003-125244 (JP), filed on Apr. 30, 2003; application No. 2003-157257 (JP), filed on Jun. 02, 2003; application No. 2003-195403 (JP), filed on Jul. 10, 2003; application No. 2003-426939 (JP), filed on Dec. 24, 2003; and application No. 2004-017355 (JP), filed on Jan. 26, 2004.
Prior Publication US 2007/0190436 A1, Aug. 16, 2007
Int. Cl. G03F 7/30 (2006.01)
U.S. Cl. 430—326  [430/270.1; 430/330; 430/905; 430/910; 436/5] 3 Claims
 
1. An evaluation method of a resist composition used in a resist pattern formation method including an immersion exposure comprising the following steps in order:
forming a resist film from the resist composition;
subjecting the film to selective exposure;
bringing an immersion solvent used in the immersion exposure in contact with the film;
subjecting the film to post exposure baking;
developing the film; and
evaluating the resulting resist pattern.