| US 7,541,070 B2 | ||
| Method of vapor-depositing strip-shaped substrates with a transparent barrier layer made of aluminum oxide | ||
| Nicolas Schiller, Stolpen Ot Helmsdorf (Germany); Steffen Straach, Dresden (Germany); Mathias Räbisch, Hohnstein Ot Hohburkesdorf (Germany); Matthias Fahland, Heidenau (Germany); and Christoph Charton, Dresden (Germany) | ||
| Assigned to Fraunhofer Gesellschaft zur Foerderung der angewandten Forschung e.V., Munich (Germany) | ||
| Appl. No. 10/536,329 PCT Filed Oct. 16, 2003, PCT No. PCT/EP03/11477 § 371(c)(1), (2), (4) Date Nov. 17, 2005, PCT Pub. No. WO2004/050945, PCT Pub. Date Jun. 17, 2004. |
||
| Claims priority of application No. 102 55 822 (DE), filed on Nov. 29, 2002. | ||
| Prior Publication US 2006/0257585 A1, Nov. 16, 2006 | ||
| Int. Cl. H05H 1/24 (2006.01) | ||
| U.S. Cl. 427—576 [428/469; 204/192.26] | 18 Claims |
| 1. A method of vapor-depositing a band-like substrate with a transparent aluminum oxide barrier layer, comprising:
(i) applying an incompletely closed metal or metal oxide layer to the substrate by magnetron sputtering, the incompletely
closed metal or metal oxide layer having a layer thickness of less than one nanometer and applied to have a thickness that
is not enough for a complete atom layer or molecule layer; and
(ii) reactively evaporating aluminum with admission of reactive gas in a band vapor-deposition facility forming a transparent
barrier layer of aluminum oxide on the incompletely closed metal or metal oxide layer.
|