| US 7,540,968 B2 | ||
| Micro movable device and method of making the same using wet etching | ||
| Anh Tuan Nguyen, Kawasaki (Japan); Tadashi Nakatani, Kawasaki (Japan); Takeaki Shimanouchi, Kawasaki (Japan); Masahiko Imai, Kawasaki (Japan); and Satoshi Ueda, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Mar. 16, 2006, as Appl. No. 11/376,114. | ||
| Claims priority of application No. 2005-079116 (JP), filed on Mar. 18, 2005. | ||
| Prior Publication US 2006/0208611 A1, Sep. 21, 2006 | ||
| Int. Cl. H01L 21/302 (2006.01) | ||
| U.S. Cl. 216—2 [216/13; 216/17; 216/39; 216/41; 216/49; 216/57; 216/83; 216/95; 216/96; 216/99; 29/25.35; 438/52; 438/53; 438/694; 438/700; 438/704; 438/745; 438/756] | 12 Claims |
| 1. A method of making a micro movable device from a material substrate the method comprising:
providing a laminate structure including a first layer, a second layer and a middle layer between the first layer and the
second layer;
forming a piezoelectric drive on the first layer;
etching the first layer using a first masking pattern to form at least one groove in the first layer extending along the piezoelectric
drive and having a depth equal to about half a thickness;
forming an etchant-resistant protective film to cover the piezoelectric drive and the at least one groove, with part of the
protective film extending into the groove;
forming a movable portion and a fixed portion by etching the first layer to expose the middle layer using a second masking
pattern; and
removing material from the middle layer between the movable portion and the second layer by wet etching.
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