| US 7,540,935 B2 | ||
| Plasma oxidation and removal of oxidized material | ||
| Yunsang Kim, San Jose, Calif. (US); Andrew D. Bailey, III, Pleasanton, Calif. (US); Hyungsuk Alexander Yoon, San Jose, Calif. (US); and Arthur M. Howald, Pleasanton, Calif. (US) | ||
| Assigned to Lam Research Corporation, Fremont, Calif. (US) | ||
| Filed on Mar. 09, 2005, as Appl. No. 11/76,725. | ||
| Application 11/076725 is a continuation in part of application No. 10/769498, filed on Jan. 30, 2004, granted, now 7,078,344. | ||
| Application 10/769498 is a continuation in part of application No. 10/769408, filed on Jan. 30, 2004, granted, now 7,232,766. | ||
| Application 10/769408 is a continuation in part of application No. 10/769522, filed on Jan. 30, 2004, granted, now 7,217,649. | ||
| Application 10/769522 is a continuation in part of application No. 10/744355, filed on Dec. 22, 2003, granted, now 7,009,281. | ||
| Application 10/744355 is a continuation in part of application No. 10/390117, filed on Mar. 14, 2003. | ||
| Application 10/390117 is a continuation in part of application No. 10/390527, filed on Mar. 14, 2003. | ||
| Prior Publication US 2006/0128152 A1, Jun. 15, 2006 | ||
| Int. Cl. H01L 21/302 (2006.01); H01L 21/461 (2006.01) | ||
| U.S. Cl. 156—345.26 [438/690; 257/E21.3] | 21 Claims |
| 1. A system for etching a conductive layer comprising:
a plasma chamber, the plasma chamber capable of enclosing a substrate, the substrate having an exposed layer of conductive
material, the plasma chamber capable of supporting a first plasma having a temperature of greater than about 200 degrees C.
and a second plasma having a temperature of less than about 100 degrees C.;
a converting species source coupled to the plasma chamber;
an etching species source coupled to the plasma chamber; and
a controller coupled to the plasma chamber, the controller including computer readable code on a computer readable medium
to control a flow of the converting species and the etching species into the plasma chamber, the controller including a recipe
including computer readable code on a computer readable medium for converting at least a portion of the conductive layer and
computer readable code on a computer readable medium for nitriding the at least a portion of the conductive layer.
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