| US 7,540,082 B2 | ||
| Method for manufacturing printed wiring board | ||
| Kohichi Ohsumi, Shiga (Japan); and Kaoru Kobayashi, Shiga (Japan) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Appl. No. 10/595,127 PCT Filed Aug. 19, 2004, PCT No. PCT/JP2004/011885 § 371(c)(1), (2), (4) Date Dec. 19, 2006, PCT Pub. No. WO2005/022970, PCT Pub. Date Mar. 10, 2005. |
||
| Claims priority of application No. 2003-305527 (JP), filed on Aug. 28, 2003. | ||
| Prior Publication US 2007/0124929 A1, Jun. 07, 2007 | ||
| Int. Cl. H01K 3/10 (2006.01); H05K 1/03 (2006.01) | ||
| U.S. Cl. 29—852 [29/846; 174/255; 174/264; 174/266] | 13 Claims |
| 1. A method of manufacturing a printed wiring board, comprising:
providing a base substrate;
forming a through hole in said base substrate;
forming a first conductor layer on a surface of said through hole and a surface of said base substrate in the vicinity of
an opening of said through hole;
filling said through hole where said first conductor layer is formed with a photosensitive resin and forming the photosensitive
resin on the opening of said through hole where said first conductor layer is formed and on a surface of said base substrate
at least in the vicinity of said opening;
performing a first exposure of said photosensitive resin at a first intensity to expose an upper portion of said photosensitive
resin without exposing photosensitive resin located within said through hole;
masking an area substantially above the opening of said through hole;
performing a second exposure of unmasked photosensitive resin at a second intensity different than said first intensity;
removing said exposed photosensitive resin; and
forming a second conductor layer covering the photosensitive resin filled inside said through hole and coupling said second
conductor layer to said first conductor layer.
|