	US 7,540,078 B1
	Method for recycling wastes of an electrical appliance
Kenichiro Suetsugu, Nishinomiya (Japan); Shunji Hibino, Hirakata (Japan); Masato Hirano, Toyonaka (Japan); Atsushi Yamaguchi, Mino (Japan); and Mikiya Nakata, Suita (Japan)
Assigned to Panasonic Corporation, Osaka (Japan)
Appl. No. 9/889,167 PCT Filed Jan. 07, 2000, PCT No. PCT/JP00/00058 § 371(c)(1), (2), (4) Date Jul. 11, 2001, PCT Pub. No. WO00/42829, PCT Pub. Date Jul. 20, 2000.
Claims priority of application No. 11-004411 (JP), filed on Jan. 11, 1999.
Int. Cl. H01R 43/00 (2006.01)

U.S. Cl. 29—825 [29/426.3; 29/426.4; 29/426.5; 75/392; 75/403; 420/562; 702/82; 340/10.4; 340/10.41; 340/10.42; 340/10.52]

2 Claims

1. A recycling method of wastes of an electrical appliance containing an article having a circuit soldered with parts soldered with a lead free solder and a housing accommodating said article wherein said housing has an IC carrying an identification information indicating presence of lead in said article or housing when said article or housing contains lead and indicating absence of lead in said article or housing when said article or housing does not contain lead, said identification information carrying information about the type and composition of the solder, kind of soldered parts, and a material of said article, said method comprising:

discriminating a first article having a circuit soldered with lead free parts from a second article having a circuit soldered with lead containing parts by means of said identification information,

recovering, grinding and melting each of the first and second articles to separate materials of said first article and materials of said second article,

recycling reusable valuables contained in said materials of said first article and said materials of said second article, and

shredding a portion of said first and second article not containing the reusable valuables and burying the portion or treating the portion at a stabilizing dumping ground or a controlled dumping ground for disposal.