| US 7,540,077 B2 | ||
| Method for bonding slider row bars for photolithography process | ||
| TaiBoon Lee, HongKong (China); and YongPing Gao, DongGuan (China) | ||
| Assigned to SAE Magnetics (H.K.) Ltd., Hong Kong (Hong Kong Special Administrative Region of the People's Republic of China, The) | ||
| Filed on Oct. 02, 2006, as Appl. No. 11/540,690. | ||
| Prior Publication US 2008/0078077 A1, Apr. 03, 2008 | ||
| Int. Cl. G11B 5/127 (2006.01); H04R 31/00 (2006.01) | ||
| U.S. Cl. 29—603.12 [29/417; 29/603.04; 29/603.06; 29/603.2; 156/89.11; 156/89.12; 156/268; 156/344; 360/235.7; 360/235.8; 360/236.3; 360/236.5; 360/236.6; 438/455; 438/458; 438/976; 451/5; 451/41] | 13 Claims |
| 1. A method for bonding slider row bars for a photolithography process, the method comprising:
(1) providing a first carrier plate having a sticky surface;
(2) providing a plurality of slider row bars, each slider row bar having a first surface for forming air bearing surface and
a second surface opposite to the first surface, and arranging each slider row bar on the first carrier plate one by one via
a tool with its first surface facing the sticky surface;
(3) providing an encapsulation glue and dispensing the glue to the second surface of each slider row bar and gaps between
the slider row bars;
(4) providing a second carrier plate and attaching the second carrier plate to the second surfaces of the slider row bars
through the encapsulation glue; and
(5) irradiating the first carrier plate and the encapsulation glue with ultraviolet light so that the first carrier plate
is removed from the slider row bars, and the encapsulation glue is cured to bond the slider row bars with the second carrier
plate together.
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