US D593,042 S
Heat sink
Takamasa Yamashita, Kyoto (Japan); Takaya Otsuki, Kyoto (Japan); Akira Hirakawa, Kyoto (Japan); and Tatsuya Akase, Kyoto (Japan)
Assigned to Nidec Corporation, Kyoto (Japan)
Filed on Jul. 29, 2008, as Appl. No. 29/322,063.
Claims priority of application No. 2008-002160 (JP), filed on Jan. 31, 2008.
Term of patent 14 Years
LOC (9) Cl. 13 - 03
U.S. Cl. D13—179
OG exemplary drawing
 
The ornamental design for a heat sink, as shown and described.