| US 7,539,961 B2 | ||
| Library-based solver for modeling an integrated circuit | ||
| Enis Aykut Dengi, Tempe, Ariz. (US); Feng Ling, Gilbert, Ariz. (US); Ben Song, McLean, Va. (US); and Warren Harris, Glendale, Ariz. (US) | ||
| Assigned to Cadence Design Systems, Inc., San Jose, Calif. (US) | ||
| Filed on Nov. 17, 2006, as Appl. No. 11/601,573. | ||
| Prior Publication US 2008/0120083 A1, May 22, 2008 | ||
| Int. Cl. G06F 17/50 (2006.01); G06F 19/00 (2006.01) | ||
| U.S. Cl. 716—5 [716/8; 716/12; 703/16] | 24 Claims |
| 1. A system for modeling an integrated circuit (IC), comprising:
a device-modeling library that includes at least one family of device models for modeling devices, each device model including
a plurality of mesh elements for modeling devices and a plurality of direct values for modeling impedances for at least some
pairs of mesh elements;
a layout specifier that is configured for specifying a layout for the integrated circuit, the layout including a plurality
of devices and a specification of parameters, placement and routing for the devices; and
a model builder that is configured for building a model for the layout from at least some device models in the device-modeling
library and saving at least some values for the model, wherein
the model includes: a mesh that includes a plurality of mesh elements for defining values on the mesh, wherein at least some
pairs of mesh elements are specified as nearby mesh-element pairs or far-away mesh-element pairs for modeling impedances,
a grid that includes a plurality of grid points for defining values on the grid, direct values for modeling impedances at
nearby mesh-element pairs of the layout, pre-correction values for modeling impedances at nearby mesh-element pairs of the
layout, indirect values for modeling impedances at far-away mesh-element pairs of the layout, projection values for projecting
values from the mesh to the grid, and interpolation values for interpolating values from the grid to the mesh.
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