US 7,539,366 B1
Optical transceiver module
Christian Wilhelmus Baks, Poughkeepsie, N.Y. (US); Fuad Elias Doany, Katonah, N.Y. (US); and Clint Lee Schow, Ossining, N.Y. (US)
Assigned to International Business Machines Corporation, Armonk, N.Y. (US)
Filed on Jan. 04, 2008, as Appl. No. 11/969,374.
Int. Cl. G02B 6/12 (2006.01); G02B 6/36 (2006.01)
U.S. Cl. 385—14  [385/33; 385/88; 385/92; 385/93] 12 Claims
OG exemplary drawing
 
1. An optical module comprising:
an opto-chip including:
a substrate that is transparent, the substrate including electrical lines and lenses integrated therein;
an array of optoelectronic devices mounted flip chip to the transparent substrate;
an array of integrated circuits associated with the array of optoelectronic devices that are mounted flip chip to the transparent substrate,
wherein the optoelectronic device array and the associated integrated circuit array are interconnected via the electrical lines in the transparent substrate, and
wherein a portion of the integrated circuit array extends beyond a dimension of the transparent substrate; and
a printed circuit board that is mounted flip chip on a first side to the portion of the integrated circuit array of the opto-chip.