| US 7,539,007 B2 | ||
| Methods and structures for electrically coupling a conductor and a conductive element comprising a dissimilar material | ||
| Hailiang Zhao, Maple Grove, Minn. (US); Steven J. May, Minnetonka, Minn. (US); Jeffrey S. Lund, Forest Lake, Minn. (US); and Kurt J. Casby, Grant, Minn. (US) | ||
| Assigned to Medtronic, Inc., Minneapolis, Minn. (US) | ||
| Filed on Dec. 29, 2005, as Appl. No. 11/321,358. | ||
| Prior Publication US 2007/0155149 A1, Jul. 05, 2007 | ||
| Int. Cl. H01G 9/04 (2006.01) | ||
| U.S. Cl. 361—508 [361/509; 361/504; 361/512; 361/523; 361/528] | 16 Claims |
| 1. A method for electrically coupling a first conductive element formed of a first conductive material to a conductor formed
of a dissimilar second material, the method comprising the steps of:
cladding a second conductive element with the conductor, the second conductive element comprising a facilitator material that
facilitates the melting of the second material;
cladding a third conductive element comprising a third material that is metallurgically compatible with the facilitator material
with a fourth conductive element comprising a fourth material that is metallurgically compatible with the first conductive
material to form a connector; and
welding the fourth conductive element and the first conductive element; and
welding the second conductive element and the third conductive element such that the conductor welds to the third conductive
element.
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