a support wafer;

a device wafer having a surface bonded to a surface of the support wafer, the device wafer comprising:

a first half proximate to the support wafer, the first half comprising:

a plurality of first spring pads;

a first support pad on a first side of a rotational axis; and

a plurality of first short stationary comb teeth extending from the first support pad toward the rotational axis;

a second half distant to the support wafer, the second half comprising:

a mirror;

first and second beam structures, each connected at a respective proximal end to the mirror and extending to a respective distal end spaced from the mirror;

a plurality of second spring pads, the second spring pads and the first spring pads at least partially overlap;

a plurality of springs coupling the first and the second beam structures to the second spring pads; and

a first stationary pad on the first side of the rotational axis, wherein the first stationary pad and the first support pad at least partially overlap;

a plurality of first long stationary comb teeth extending from the first stationary pad toward the rotational axis, wherein the first long stationary comb teeth and the first short stationary comb teeth partially overlap;

a plurality of first long rotating comb teeth extending from a first edge of the first and the second beam structures toward the first long stationary comb teeth, the first long rotating comb teeth being interdigitated out-of-plane at their tips with the first short stationary comb teeth, the first long rotating comb teeth being interdigitated in-plane substantially along their lengths with the first long stationary comb teeth.