| US 7,538,653 B2 | ||
| Grounding of magnetic cores | ||
| Gerhard Schrom, Hillsboro, Oreg. (US); Donald Gardner, Mountain View, Calif. (US); Peter Hazucha, Beaverton, Oreg. (US); Fabrice Paillet, Hillsboro, Oreg. (US); and Tanay Karnik, Portland, Oreg. (US) | ||
| Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
| Filed on Mar. 30, 2007, as Appl. No. 11/694,812. | ||
| Prior Publication US 2008/0238596 A1, Oct. 02, 2008 | ||
| Int. Cl. H01F 5/00 (2006.01) | ||
| U.S. Cl. 336—200 | 13 Claims |
| 1. An apparatus, comprising:
a magnetic core integrated on a chip or die, the magnetic core including a first magnetic layer and a second magnetic layer;
a ground node above or underneath both the first magnetic layer and the second magnetic layer; and
one or more vias to provide a connection between the magnetic core and the ground node.
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