| US 7,538,562 B2 | ||
| High performance miniature RF sensor for use in microelectronics plasma processing tools | ||
| Craig Garvin, Cambridge, Mass. (US); Michael Bonner, Gardiner, N.Y. (US); and Kenneth Rosys, Liverpool, N.Y. (US) | ||
| Assigned to Inficon, Inc., East Syracuse, N.Y. (US) | ||
| Filed on Mar. 19, 2007, as Appl. No. 11/725,275. | ||
| Claims priority of provisional application 60/783894, filed on Mar. 20, 2006. | ||
| Prior Publication US 2007/0222428 A1, Sep. 27, 2007 | ||
| Int. Cl. G01R 27/26 (2006.01) | ||
| U.S. Cl. 324—687 [315/111.21; 313/495; 361/760] | 21 Claims |
| 1. A miniature RF sensor assembly for measuring the RF current and voltage supplied to a plasma processing chamber of a microelectronics
processing tool by a high power RF power supply, said assembly comprising:
a sensor head, said sensor head being defined by a multi-sided enclosure;
a conductor, said conductor being formed by a strap conductor of a plasma processing tool, said conductor further forming
a side of said enclosure;
a voltage pickup; and
a current pickup, and
each of said voltage pickup and said current pickup being disposed within said sensor head, each of said voltage pickup and
said current pickups are being stacked upon one another within said sensor head in relation to said conductor, said conductor
being part of said plasma processing tool to which said sensor head is mounted.
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