| US 7,538,423 B2 | ||
| Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device | ||
| Tomio Ono, Yokohama (Japan); Tadashi Sakai, Yokohama (Japan); Naoshi Sakuma, Yokohama (Japan); Hiroaki Yoshida, Yokohama (Japan); and Mariko Suzuki, Yokohama (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Sep. 22, 2006, as Appl. No. 11/534,355. | ||
| Claims priority of application No. 2006-074746 (JP), filed on Mar. 17, 2006. | ||
| Prior Publication US 2007/0216024 A1, Sep. 20, 2007 | ||
| Int. Cl. H01L 23/10 (2006.01); H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—706 [257/713; 257/712; 257/E23.103] | 7 Claims |
| 1. A heat sink comprising:
a base portion formed of insulating diamond;
a plurality of first pressure contacting members formed of the insulating diamond and arranged on the base portion;
a plurality of second pressure contacting members spaced apart from the first pressure members on the base portion and formed
of the insulating diamond; and
a fixing base member provided on a second surface of the base portion opposite to a first surface on which the first and second
pressure contacting members are arranged, the fixing base member having a slot provided on an area on the second surface,
the area is opposite to a space between the first pressure contacting members and the second pressure contacting members.
|