| US 7,538,421 B2 | ||
| Flip-chip package structure with stiffener | ||
| Jau-Shoung Chen, Hsinchu County (Taiwan) | ||
| Assigned to Advanced Semiconductor Engineering, Inc., Kao-Hsiung (Taiwan) | ||
| Filed on Nov. 22, 2006, as Appl. No. 11/562,970. | ||
| Claims priority of application No. 95124049 A (TW), filed on Jun. 30, 2006. | ||
| Prior Publication US 2008/0001308 A1, Jan. 03, 2008 | ||
| Int. Cl. H01L 23/13 (2006.01) | ||
| U.S. Cl. 257—704 [257/778; 257/730] | 7 Claims |
| 1. A flip-chip package structure with stiffener comprising:
a substrate;
a first stiffener having an upper surface and a bottom surface larger than the upper surface positioned on a surface of the
substrate, and the first stiffener being positioned on the substrate with the bottom surface; a chip having a plurality of
solder bumps for electrically connecting the chip to the substrate; and
a second stiffener positioned on the surface of the substrate and connecting with the first stiffener;
wherein the first stiffener is positioned outside of the second stiffener, and the first stiffener, the second stiffener and
the chip are co-planar.
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