| US 7,538,356 B2 | ||
| Combination assembly of LED and liquid-vapor thermally dissipating device | ||
| Yaw-Huey Lai, Taipei County (Taiwan) | ||
| Assigned to Tai-Sol Electronics Co., Ltd, Taipei (Taiwan) | ||
| Filed on Feb. 07, 2007, as Appl. No. 11/703,167. | ||
| Claims priority of application No. 95143210 A (TW), filed on Nov. 22, 2006. | ||
| Prior Publication US 2008/0117601 A1, May 22, 2008 | ||
| Int. Cl. H01L 29/18 (2006.01) | ||
| U.S. Cl. 257—88 [257/99] | 3 Claims |
| 1. A combination assembly of at least one LED unit and a liquid-vapor heat-dissipating device, wherein:
said liquid-vapor heat-dissipating device has a metal housing, a predetermined amount of liquid located in said metal housing,
and a capillary member located in said metal housing; and
said at least one LED unit is mounted to a surface of said metal housing and has an LED chip, a wire, an insulating board,
an electrode, and a sealant, said LED chip being mounted to the surface of said housing and electrically conducted with said
housing, said insulating board being mounted to the surface of said housing, said electrode being located on said insulating
board, said sealant fully encapsulating said wire and said LED chip and at least partially encapsulating said insulating board
and said electrode,
wherein said insulating board and said electrode are incorporated to form a circuit board, said liquid-vapor heat-dissipating
device is a heat pipe, said at least one LED unit is numerous and said LED units are connected in series and arranged on said
liquid-vapor heat-dissipating device, and said insulating board and said electrode of each of the LED units are incorporated
to form said circuit board.
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