US 7,538,166 B2
Epoxy compounds and cured epoxy resins obtained by curing the compounds
Shinya Tanaka, Toyono-gun (Japan); Yoshitaka Takezawa, Hitachi (Japan); and Hiroyuki Takahashi, Hitachi (Japan)
Assigned to Sumitomo Chemical Company, Limited, Tokyo (Japan); and Hitachi, Ltd., Tokyo (Japan)
Appl. No. 10/584,307
PCT Filed Dec. 22, 2004, PCT No. PCT/JP2004/019186
§ 371(c)(1), (2), (4) Date Jun. 23, 2006,
PCT Pub. No. WO2005/061473, PCT Pub. Date Jul. 07, 2005.
Claims priority of application No. 2003-426610 (JP), filed on Dec. 24, 2003.
Prior Publication US 2007/0184280 A1, Aug. 09, 2007
Int. Cl. C08G 59/04 (2006.01); B32B 27/04 (2006.01)
U.S. Cl. 525—523  [428/413; 428/297.4] 10 Claims
 
1. An epoxy compound represented by the formula (2):

OG Complex Work Unit Drawing
wherein
A4 denotes a divalent group represented by the following formula:

OG Complex Work Unit Drawing
in which R denotes a hydrogen atom or an alkyl group of 1 to 18 carbon atoms, c denotes an integer of 1 to 7, h denotes an integer of 1 to 4, and when more than one R exists in said divalent group, all of R may be the same group or different groups;
R1, R2, R3, R4, R5 and R6 are the same or different and each denotes a hydrogen atom or an alkyl group of 1 to 18 carbon atoms; and
Q3 denotes any one of groups represented by the following formulas:

OG Complex Work Unit Drawing
in which m denotes an integer of 1 to 9, p and q denote an integer of 1 to 8, and the sum of p and q is 9 or less, and methylene groups composing the group represented by Q3 are optionally substituted with an alkyl group of 1 to 18 carbon atoms.