| US 7,538,150 B2 | ||
| Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin | ||
| Kenichi Oohori, Shimodate (Japan); Yoshihiro Nakamura, Shimodate (Japan); Hikari Murai, Yuki (Japan); Yoshiyuki Takeda, Shimodate (Japan); Yasuyuki Hirai, Oyama (Japan); Shinichi Kamoshida, Shimodate (Japan); Minoru Kakitani, Shimodate (Japan); Norihiro Abe, Shimodate (Japan); Syunichi Numata, Hitachi (Japan); Teruki Aizawa, Utsunomiya (Japan); and Ken Nanaumi, Shimodate (Japan) | ||
| Assigned to Hitachi Chemical Company, Ltd, Tokyo (Japan) | ||
| Filed on Sep. 07, 2005, as Appl. No. 11/219,821. | ||
| Application 11/219821 is a continuation of application No. 10/250770, abandoned, previously published as PCT/JP02/00063, filed on Jan. 10, 2002. | ||
| Claims priority of application No. 2001-2763 (JP), filed on Jan. 10, 2001. | ||
| Prior Publication US 2006/0008632 A1, Jan. 12, 2006 | ||
| Int. Cl. B32B 15/08 (2006.01); B32B 27/04 (2006.01); B32B 27/28 (2006.01); C08K 5/521 (2006.01); C08L 61/08 (2006.01); C08L 63/02 (2006.01); H05K 1/05 (2006.01) | ||
| U.S. Cl. 523—429 [174/259; 428/175; 428/297.4; 428/418; 523/506; 525/486] | 26 Claims |
| 1. A thermosetting resin composition which comprises:
(A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component;
(B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde;
and
(C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of a total amount of organic solid components
of Components (A), (B) and (C); wherein at least a part of the epoxy resin comprises
(i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000, or
(ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of
1,000 to 3,000.
|