| US 7,537,969 B2 | ||
| Fuse structure having reduced heat dissipation towards the substrate | ||
| Piebe Zijstra, Middelaar (Netherlands); and Ann Killian, Pleasant Valley, N. Mex. (US) | ||
| Assigned to NXP B.V., Eindhoven (Netherlands) | ||
| Appl. No. 10/572,422 PCT Filed Sep. 18, 2004, PCT No. PCT/IB2004/051791 § 371(c)(1), (2), (4) Date Nov. 21, 2006, PCT Pub. No. WO2005/029582, PCT Pub. Date Mar. 31, 2005. |
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| Claims priority of provisional application 60/504390, filed on Sep. 19, 2003. | ||
| Prior Publication US 2007/0087543 A1, Apr. 19, 2007 | ||
| Int. Cl. H01L 21/82 (2006.01) | ||
| U.S. Cl. 438—132 [438/601; 257/E21.592] | 11 Claims |
| 1. A method of manufacturing a fuse structure, comprising:
providing an electrically insulating substrate;
forming a first blanket layer of a first material over the substrate;
forming a second blanket layer of a second material over the first blanket layer;
patterning the second and first layers to form a first patterned structure;
forming a passivation layer over the first patterned structure;
etching an opening in the passivation layer such that a portion of the first patterned structure is exposed; and
isotropically etching at least a portion of the first material within the opening in the passivation layer.
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