| US 7,537,837 B2 | ||
| Heat conductive silicone rubber composite sheet | ||
| Hiroshi Takei, Usui-gun (Japan); and Akio Suzuki, Tano-gun (Japan) | ||
| Assigned to Shin-Etsu Chemical Co., Ltd., Tokyo (Japan) | ||
| Filed on Sep. 23, 2003, as Appl. No. 10/667,671. | ||
| Claims priority of application No. 2002-292209 (JP), filed on Oct. 04, 2002. | ||
| Prior Publication US 2004/0067372 A1, Apr. 08, 2004 | ||
| Int. Cl. B32B 9/04 (2006.01) | ||
| U.S. Cl. 428—447 [428/473.5; 428/480; 524/588; 528/24; 528/34] | 14 Claims |
| 1. A heat conductive silicone rubber composite sheets comprising;
a laminated structure with an intermediate layer and a pair of outer layers laminated to both surfaces of said intermediate
layer, wherein
(A) said intermediate layer is a layer of a synthetic resin film that displays heat resistance and electrical insulation and
said intermediate layer has no pores of at least 0.3 mm in diameter, and
(B) said outer layers are silicone rubber layers formed by curing a composition comprising (a) an organopolysiloxane, (b)
a curing agent, (c) a heat conductive filler, and (d) a silicon compound-based adhesion imparting agent with at least one
functional group selected from the group consisting of epoxy groups, alkoxy groups, vinyl groups, and the group represented
by the formula Si—H;
wherein said curing agent of said component (b) is an organic peroxide; and
wherein said synthetic resin comprises an aromatic polyimide or a polyethylene naphthalate.
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