| US 7,537,668 B2 | ||
| Method of fabricating high density printed circuit board | ||
| Ryoichi Watanabe, Daejeon (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyunggi-Do (Korea, Republic of) | ||
| Filed on Jun. 06, 2005, as Appl. No. 11/146,779. | ||
| Claims priority of application No. 10-2004-0056867 (KR), filed on Jul. 21, 2004; and application No. 10-2005-0016840 (KR), filed on Feb. 28, 2005. | ||
| Prior Publication US 2006/0016553 A1, Jan. 26, 2006 | ||
| Int. Cl. B32B 37/12 (2006.01); B32B 38/10 (2006.01); C23C 20/00 (2006.01); H05K 1/16 (2006.01); B32B 37/16 (2006.01); C23C 24/02 (2006.01) | ||
| U.S. Cl. 156—257 [156/233; 156/239; 156/241; 156/268; 438/118; 427/96.1; 427/96.2; 427/97.1; 427/123; 29/825; 29/830; 29/831; 174/260; 216/13; 216/20] | 9 Claims |
| 1. A method of fabricating a high density printed circuit board, comprising the steps of:
attaching an adhesive to one surface of a reinforced substrate;
forming a seed layer on the adhesive using a first metal; and
forming a circuit pattern on the seed layer using a second metal, the first metal and the second metal being different;
laminating an insulating layer on the circuit pattern, and removing the reinforced substrate; and
removing the seed layer using a selective etchant capable of etching only the seed layer without etching the circuit pattern.
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