| US 7,537,498 B2 | ||
| Solder-bearing contacts and method of manufacture thereof and use in connectors | ||
| Joseph Cachina, Warwick, R.I. (US); James Zanolli, North Smithfield, R.I. (US); and Jack Seidler, Flushing, N.Y. (US) | ||
| Assigned to Interplex Nas, Inc., College Point, N.Y. (US) | ||
| Filed on Oct. 31, 2007, as Appl. No. 11/981,927. | ||
| Application 11/981927 is a continuation of application No. 10/922789, filed on Aug. 19, 2004, granted, now 7,347,750. | ||
| Claims priority of provisional application 60/499811, filed on Sep. 02, 2003. | ||
| Prior Publication US 2008/0070453 A1, Mar. 20, 2008 | ||
| Int. Cl. H01R 4/02 (2006.01) | ||
| U.S. Cl. 439—876 | 7 Claims |
| 1. A surface mount contact for coupling to an electronic device comprising:
a conductive pin having an elongated body including a first end and a second end;
a heat re-flowable bonding member coupled to the first end; and
a conductive locator member disposed around the conductive pin in a region of the conductive pin between the second end and
the heat re-flowable bonding member, wherein the locator member is a collar that radially protrudes from the conductive pin,
the locator member having a conductive surface and an opening through which the conductive pin extends such that an annular
volume of space extending radially outward from the conductive pin and substantially free of material is defined between the
conductive surface of the locator member and the bonding member.
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