| US 7,537,493 B2 | ||
| Method for forming a connector assembly for use with an implantable medical device | ||
| Andrew J. Ries, Lino Lakes, Minn. (US); Jay K. Lahti, Shoreview, Minn. (US); George Patras, Greenfield, Minn. (US); John D. Longtin, Lake Elmo, Minn. (US); and Bryan J. Zart, Shakopee, Minn. (US) | ||
| Assigned to Medtronics, Inc., Minneapolis, Minn. (US) | ||
| Filed on Jul. 11, 2008, as Appl. No. 12/171,337. | ||
| Application 12/171337 is a division of application No. 11/281008, filed on Nov. 17, 2005, granted, now 7,413,482. | ||
| Prior Publication US 2008/0268720 A1, Oct. 30, 2008 | ||
| Int. Cl. H01R 13/405 (2006.01) | ||
| U.S. Cl. 439—736 [29/841; 607/36] | 7 Claims |
| 1. An interconnect ribbon assembly adapted for use in a connector assembly for an implantable medical device, the interconnect
ribbon assembly comprising:
a first interconnect ribbon section comprising at least one conductive finger element and a tie-bar portion, each finger element
having a free end for attachment to an electrical connector element of the connector assembly and a fixed end attached to
the tie-bar portion;
a second interconnect ribbon section separately formed from the first interconnect ribbon section, the first interconnect
ribbon section comprising at least one conductive finger element and a tie-bar portion, each finger element having a free
end for attachment to an electrical connector element of the connector assembly and a fixed end attached to the tie-bar portion;
and
a mechanical joint mechanically joining the tie-bar portions of the first and second interconnect ribbon sections.
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