| US 7,537,148 B2 | ||
| Bonding apparatus comprising improved oscillation amplification device | ||
| Srikanth Narasimalu, Singapore (Singapore); Sathish Kumar Balakrishnan, Singapore (Singapore); and Chee Tiong Lim, Singapore (Singapore) | ||
| Assigned to ASM Technology Singapore Pte Ltd., Singapore (Singapore) | ||
| Filed on Oct. 14, 2005, as Appl. No. 11/250,260. | ||
| Prior Publication US 2007/0084900 A1, Apr. 19, 2007 | ||
| Int. Cl. B23K 1/06 (2006.01) | ||
| U.S. Cl. 228—1.1 [228/110.1; 228/4.5; 228/180.5; 156/73.1] | 10 Claims |
| 1. A bonding apparatus comprising:
an oscillation amplification device having a longitudinal axis;
a mounting barrel coupled to the oscillation amplification device;
an ultrasonic driver coupled to the oscillation amplification device at a first position along the longitudinal axis; and
a bonding tool mounted to the oscillation amplification device at a second position along the longitudinal axis spaced from
the first position;
wherein the oscillation amplification device has a substantially triangular cross-sectional area on a plane that is orthogonal
to the longitudinal axis,
the bonding apparatus further comprising a clamp that is configured to clamp the mounting barrel at clamping positions located
away from the vertices of the triangular cross-sectional area such that each clamping position is generally aligned with a
side of the triangle.
|