US 7,537,047 B2
Liquid-cooling heat sink
Cheng-Tien Lai, Guangdong (China); and Zhi-Yong Zhou, Guangdong (China)
Assigned to Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan); and Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Longhua Town, Bao'an District, Shenzhen, Guangdong Province (China)
Filed on Mar. 23, 2006, as Appl. No. 11/308,426.
Prior Publication US 2007/0221364 A1, Sep. 27, 2007
Int. Cl. H05K 7/20 (2006.01)
U.S. Cl. 165—80.4  [257/714; 361/699] 18 Claims
OG exemplary drawing
 
1. A liquid-cooling heat sink comprising:
a base;
a heat exchanger having a hollow formed therein, the heat exchanger being thermally coupled to a top surface of the base;
a housing having a chamber formed therein, the housing being placed over the base with the heat exchanger enclosed within the chamber, the chamber being separated by the heat exchanger into a first sub-chamber encircled by the heat exchanger and a second sub-chamber encircling the heat exchanger, the first sub-chamber being in fluid communication with the second sub-chamber through a plurality of microchannels formed within the heat exchanger;
an inlet fluidly connected to the first sub-chamber so as to impinge liquid coolant onto the top surface of the base; and
an outlet fluidly connected to the second sub-chamber so as to drain liquid coolant from the second sub-chamber;
wherein the heat exchanger includes a plurality of annular plates coaxially stacked one on another, each annular plate having a plurality of first perforate sectors and a plurality of second perforate sectors arranged alternately.