	US 7,537,046 B2
	Heat dissipation device with heat pipe
Dong-Bo Zheng, Shenzhen (China); Lei Cao, Shenzhen (China); Meng Fu, Shenzhen (China); and Chun-Chi Chen, Taipei Hsien (Taiwan)
Assigned to Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan)
Filed on Apr. 02, 2007, as Appl. No. 11/695,462.
Prior Publication US 2008/0236798 A1, Oct. 02, 2008
Int. Cl. F28D 15/00 (2006.01); H05K 7/20 (2006.01)

U.S. Cl. 165—80.3 [165/104.21]

3 Claims

1. A heat dissipation device comprising:

a base for thermally engaging with a heat-generating electronic component;

first and second fin assemblies mounted on the base;

a first heat pipe having an evaporation section mounted on the base and thermally connecting therewith, condensation sections extending through the first and second fin assemblies, respectively, and connecting sections interconnecting the evaporation section and the condensation sections;

a second heat pipe having an evaporation section mounted on the base and thermally connecting therewith, condensation sections extending through the first and second fin assemblies, respectively, and connecting sections interconnecting the evaporation section and the condensation sections of the second heat pipe, wherein the condensation sections of the first heat pipe are located above the condensation sections of the second heat pipe;

wherein the condensation sections of the first heat pipe are separated from each other and extend toward each other, the condensation sections of the second heat pipe are separated from each other and extend toward each other, and the first and second fin assemblies are separate from each other; and

wherein a first included angle is formed between the connecting sections of the first heat pipe and a second included angle is formed between the connecting sections of the second heat pipe, the first included angle being smaller than the second included angle.