| US 7,536,909 B2 | ||
| Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same | ||
| Yang Zhao, Andover, Mass. (US); Feiming Huang, Wuxi (China); and Zongya Li, Wuxi (China) | ||
| Assigned to Memsic, Inc., No. Andover, Mass. (US) | ||
| Filed on Jan. 20, 2006, as Appl. No. 11/336,336. | ||
| Prior Publication US 2007/0170228 A1, Jul. 26, 2007 | ||
| Int. Cl. G01P 1/02 (2006.01); G01P 15/08 (2006.01) | ||
| U.S. Cl. 73—493 [73/510] | 10 Claims |
| 1. A method of manufacturing a device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction,
the method comprising the steps of:
providing a leadframe, a plurality of input/output leads, and a plurality of z-axis sensor leads;
attaching at least one X- and Y-axis sensor die, having orthogonal sensing directions, and at least one integrated circuit
to be in at least one of physical communication and operational communication with the leadframe, the plurality of input/output
leads, and the plurality of z-axis sensor leads;
attaching a z-axis sensor die, having a sensing direction, to at least two of the plurality of input/output leads and to at
least two of the plurality of Z-axis sensor leads so that the sensing direction of said Z-axis sensor die is in the same or
substantially the same plane as the orthogonal sensing directions of the at least one X- and Y-axis sensor die;
pre-encapsulating the Z-axis sensor die, some portion of the plurality of input/output leads, and some portion of the plurality
of Z-axis sensor leads; and
re-positioning the pre-encapsulated Z-axis sensor die so that its sensing direction is orthogonal or substantially orthogonal
to the orthogonal sensing directions of the at least one X- and Y-axis sensor die; and
encapsulating the leadframe, the plurality of input/output leads, the plurality of Z-axis sensor leads, the at least one X-
and Y-axis sensor die, the at least one integrated circuit, and the pre-encapsulated Z-axis sensor die in a final molding.
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