| US 7,536,776 B2 | ||
| Fabrication method for thin film magnetic heads | ||
| Nobuo Yoshida, Kanagawa (Japan); Taku Shintani, Kanagawa (Japan); and Hisako Takei, Kanagawa-ken (Japan) | ||
| Assigned to Hitachi Global Storage Technologies Netherlands B.V., Amsterdam (Netherlands) | ||
| Filed on Jun. 13, 2006, as Appl. No. 11/454,310. | ||
| Claims priority of application No. 2005-174117 (JP), filed on Jun. 14, 2005. | ||
| Prior Publication US 2006/0278604 A1, Dec. 14, 2006 | ||
| Int. Cl. G11B 5/127 (2006.01); H04R 31/00 (2006.01) | ||
| U.S. Cl. 29—603.16 [29/603.13; 29/603.14; 29/603.15; 29/603.18; 216/62; 216/65; 216/66; 360/121; 360/122; 360/317; 360/324; 360/325; 427/127; 427/128; 451/5; 451/41] | 24 Claims |
| 1. A fabrication method for thin film magnetic heads comprising:
forming a CPP sensor film over a lower shield;
forming a first CMP stop film over the CPP sensor film;
etching the CPP sensor film and forming a track width on the CPP sensor film;
covering at least the etching section of the CPP sensor film with an insulating film;
forming a CMP dummy film over the insulating film;
forming a second CMP stop film over the CMP dummy film;
exposing the first CMP stop film;
removing the first CMP stop film and the second CMP stop film by oxygen RIE;
removing the CMP dummy film by fluorine RIE and;
forming an upper shield film over the insulating film and over the CPP sensor film.
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